The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Dec. 25, 2015
Applicant:

A-sat Corporation, Tokyo, JP;

Inventor:

Takayuki Suzuki, Tokyo, JP;

Assignee:

A-SAT CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01J 37/32 (2006.01); H05H 1/46 (2006.01); H01L 21/3065 (2006.01); G01B 11/12 (2006.01); C23C 16/455 (2006.01); G01N 21/954 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32541 (2013.01); C23C 16/45565 (2013.01); G01B 11/12 (2013.01); G01N 21/954 (2013.01); H01J 37/32082 (2013.01); H01J 37/3288 (2013.01); H01J 37/3299 (2013.01); H01J 37/32449 (2013.01); H01J 37/32532 (2013.01); H01J 37/32853 (2013.01); H01J 37/32926 (2013.01); H01J 37/32935 (2013.01); H01J 37/32972 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H05H 1/46 (2013.01); H01J 2237/2449 (2013.01); H01J 2237/334 (2013.01);
Abstract

A method of measuring with which it is possible to measure with a high accuracy a gas introducing hole provided in an electrode for a plasma etching device, and to provide an electrode provided with a highly-accurate gas introducing hole is described. This method is provided to penetrate through in the thickness direction of a base material of the electrode for the plasma etching device, provided with: a step of radiating light toward the gas introducing hole from one surface side of the substrate; a step of acquiring a two-dimensional image of light which has passed through the gas introducing hole to the other surface side of the substrate; and a step of measuring at least one of the diameter, the inner wall surface roughness, and the degree of verticality of the gas introducing hole, on the basis of the two dimensional image.


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