The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Jul. 30, 2014
Applicant:

Ubotic Company Limited, Tsuen Wan, CN;

Inventor:

Chun Ho Fan, Tsuen Wan, CN;

Assignee:

UBOTIC COMPANY LIMITED, Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/047 (2006.01); H01L 23/10 (2006.01); H01L 23/498 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 21/50 (2013.01); H01L 23/047 (2013.01); H01L 23/10 (2013.01); H01L 23/49575 (2013.01); H01L 23/49582 (2013.01); H01L 23/49861 (2013.01); H01L 24/97 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/85464 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/165 (2013.01); H01L 2924/167 (2013.01); H01L 2924/1659 (2013.01); H01L 2924/16251 (2013.01);
Abstract

A cavity package is disclosed comprising a metal leadframe, a metal ring connected to the metal leadframe, a plastic body molded to the metal leadframe forming a substrate cavity including an exposed die attach pad of the leadframe for affixing a semiconductor device, exposed lead fingers of the leadframe for wire bonding to the semiconductor device and an external circuit, and an exposed top surface of the metal ring, and a metal cap for closing and encapsulating the substrate cavity. The metal ring is integrated into the pre-molded cavity leadframe for providing an electrical ground path from the metal cap to the die attach pad and permitting attachment of the metal cap to the pre-molded leadframe using solder reflow.


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