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Forward Citations = 16

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6 inventors (with patents filed for the assignee):

Chun Ho Fan (6 out of 51 patents)

Ming-Wa Tam (4 out of 4 patents)

Ken Lik Hang Wan (1 out of 1 patent)

4. Zhang Xiao Ping (1 out of 1 patent)

5. Sin Chi Wai (1 out of 1 patent)

6. Wa San Leung (1 out of 1 patent)

11 patents: Sort by Forward Citations

1. 10777457 - Carrier substrate, package, and method of manufacture (2020-09-15),

2. 10458826 - Mass flow sensor module and method of manufacture (2019-10-29),

3. 10014187 - Cavity package with pre-molded substrate (2018-07-03),

4. 9991194 - Sensor package and method of manufacture (2018-06-05),

5. 9887149 - Cavity package with die attach pad (2018-02-06),

6. 9865528 - High power and high frequency plastic pre-molded cavity package (2018-01-09),

7. 9659855 - Cavity package with pre-molded substrate (2017-05-23),

8. 9601413 - Cavity package with die attach pad (2017-03-21),

9. 9536812 - Cavity package with pre-molded cavity leadframe (2017-01-03),

10. D757538 - Sensor housing (2016-05-31),

11. 9257370 - Cavity package with pre-molded cavity leadframe (2016-02-09),

Ubotic Company Limited is a leading provider of robotic automation solutions for various industries. With a focus on innovation and efficiency, we offer cutting-edge robotic technology to streamline processes and increase productivity. Our team of experienced engineers and technicians work closely with clients to design and implement customized robotic solutions to meet their specific needs. From automated assembly lines to robotic warehouse systems, Ubotic is dedicated to delivering high-quality solutions that drive business success.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

11 Patents

#278 in Hong Kong

#2,241 in China

#50,159 in the World

Hong Kong, China

Ubotic Company Limited