The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Oct. 03, 2017
Applicant:
Ubotic Company Limited, Tsuen Wan, Hong Kong, CN;
Inventor:
Ming-Wa Tam, Hong Kong, CN;
Assignee:
UBOTIC COMPANY LIMITED, Tsuen Wan, Hong Kong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/31 (2006.01); H05K 3/42 (2006.01); H05K 1/11 (2006.01); H01L 23/13 (2006.01); H05K 3/02 (2006.01); H05K 3/10 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 23/13 (2013.01); H01L 23/3114 (2013.01); H01L 23/49541 (2013.01); H01L 23/49861 (2013.01); H05K 1/117 (2013.01); H05K 3/022 (2013.01); H05K 3/108 (2013.01); H05K 3/427 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 2224/48227 (2013.01); H05K 2201/09554 (2013.01);
Abstract
A method of manufacturing, a carrier, and a semiconductor package are provided. The method involves depositing a plurality of conductive vias, applying a molding material over the lead frame, grinding the molding material to expose the plurality of conductive vias, and depositing a metalized pattern over the molding material. The carrier is manufacture by this method and the semiconductor package is formed based on the carrier.