This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Ubotic Company Limited. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: Innovations of Zhang Xiao Ping
Introduction
Zhang Xiao Ping is a notable inventor based in Ningdu, China. He has made significant contributions to the field of technology, particularly in the development of advanced packaging solutions for semiconductor devices. His innovative approach has led to the creation of a unique patent that addresses the challenges in high power and high frequency applications.
Latest Patents
Zhang Xiao Ping holds a patent for a "High power and high frequency plastic pre-molded cavity package." This invention outlines a method for manufacturing a cavity package that includes several key steps. The process involves attaching a metal heat sink to a leadframe using a thermally conductive and electrically insulating intermediate structure. A plastic body is then molded around the heat sink and exposed leads of the leadframe to form a cavity. This cavity features partially and selectively exposed lead top surfaces, as well as the top and bottom surfaces of the heat sink. A semiconductor device die is attached within the cavity to the exposed top surface of the heat sink using a thermally conductive material. The invention also includes wire bonding the respective wire bond pads of the semiconductor device die to the exposed lead top surfaces and the heat sink for grounding. Finally, a lid is attached to the plastic molded body to protect the wire bonded device within the cavity.
Career Highlights
Zhang Xiao Ping is currently employed at Ubotic Company Limited, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of semiconductor packaging, making it more efficient and reliable for high-performance applications.
Collaborations
Zhang collaborates with Sin Chi Wai, who is also involved in the field of technology and innovation. Their partnership has fostered a creative environment that encourages the development of cutting-edge solutions.
Conclusion
Zhang Xiao Ping's contributions to the field of semiconductor packaging through his innovative patent demonstrate his expertise and commitment to advancing technology. His work at Ubotic Company Limited continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile