The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Apr. 11, 2014
Applicant:

Ubotic Company Limited, Tsuen Wan, CN;

Inventor:

Chun Ho Fan, Tsuen Wan, CN;

Assignee:

UBOTIC COMPANY LIMITED, Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 23/057 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 21/50 (2013.01); H01L 21/56 (2013.01); H01L 23/057 (2013.01); H01L 23/49506 (2013.01); H01L 23/49517 (2013.01); H01L 23/49551 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A cavity package is provided. The package can include a metal leadframe and a substrate attached to an interposer formed as part of the leadframe. The substrate typically has a coefficient of thermal expansion matched to the coefficient of thermal expansion of a semiconductor device to be affixed to the substrate. The semiconductor device is typically attached to an exposed top surface of the substrate. The cavity package also includes a plastic portion molded to the leadframe forming a substrate cavity. The substrate cavity allows access to the exposed top surface of the substrate for affixing the semiconductor device. The cavity package also include a connective element for grounding a lid through an electrical path from the lid to the interposer.


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