Mitsuaki Katagiri

USPTO Granted Patents = 63 (Patent Applications = 11)

Average Co-Inventor Count = 3.6

ph-index = 12

Forward Citations = 497(Granted Patents)

Forward Citations (Not Self Cited) = 491(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Higashimurayama, JP (1999)
Koganei, JP (2001)
Nishitokyo, JP (2004 - 2010)
Chuo-ku, JP (2009 - 2014)
Tokyo Nishitokyo, JP (2018 - 2019)
Tokyo, JP (2006 - 2023)

Company Filing History:

Renesas Technology Corp.

Micron Technology Incorporated

patents

6. 1 out of 1

Hitachi, Ltd., Intellectual Property Group

Renesas Eastern Japan Semiconductor, Inc.

patents

9. 1 out of 52

Longitude Semiconductor S.a.r.l.

11. 3 out of 832,843

Other

patents

where one patent can have more than one assignee

Years Active: 1999-2023

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Areas of Expertise:

Stacked Die Package

Semiconductor Device

Bonding Wires

Face-To-Face Arrangements

Multichip Package

Inductance Analysis

BGA Semiconductor Device

Power-Supply Plane

Solder Joint Lifetimes

Dielectric Layer

Fine Pitch Grid Array

Semiconductor Storage Device

63 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11705432 - Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices (2023-07-18),

2. 11081468 - Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses (2021-08-03),

3. 10600762 - Apparatuses comprising semiconductor dies in face-to-face arrangements (2020-03-24),

4. 10431566 - Apparatuses comprising semiconductor dies in face-to-face arrangements (2019-10-01),

5. 10115709 - Apparatuses comprising semiconductor dies in face-to-face arrangements (2018-10-30),

6. 9595489 - Semiconductor package with bonding wires of reduced loop inductance (2017-03-14),

7. 9589921 - Semiconductor device (2017-03-07),

8. 9418967 - Semiconductor device (2016-08-16),

9. 9048221 - Device having electrodes formed from bumps with different diameters (2015-06-02),

10. 8970052 - Semiconductor device stack with bonding layer and wire retaining member (2015-03-03),

11. 8941237 - Semiconductor device (2015-01-27),

12. 8853822 - Semiconductor device (2014-10-07),

13. 8796077 - Semiconductor device (2014-08-05),

14. 8680881 - Test method and interposer used therefor (2014-03-25),

15. 8633596 - Semiconductor package with bonding wires of reduced loop inductance (2014-01-21),

Title: The Innovative Journey of Mitsuaki Katagiri

Introduction: Mitsuaki Katagiri is a renowned inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Mitsuaki Katagiri holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Katagiri has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant advancements in various industries.

Collaborations: Throughout his career, Mitsuaki Katagiri has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Mitsuaki Katagiri's relentless pursuit of innovation and his passion for creating solutions to complex technological challenges have solidified his position as a pioneering inventor in the global tech landscape.

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11 patents pending:

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