The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Nov. 07, 2012
Applicant:
Ps4 Luxco S.a.r.l., Luxembourg, LU;
Inventors:
Yu Hasegawa, Tokyo, JP;
Mitsuaki Katagiri, Tokyo, JP;
Assignee:
PS4 Luxco S.a.r.l., Luxembourg, LU;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 24/97 (2013.01); H01L 2224/14517 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2224/14155 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/14156 (2013.01); H01L 2224/1415 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13021 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/14177 (2013.01); H01L 2924/00013 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A device has a first substrate having a first surface; a first electrode pad arranged on the first surface of the first substrate; a first insulator film provided on the first surface of the first substrate so that the first electrode pad is exposed; a first bump electrode provided on the first electrode pad and having a first diameter; and a second bump electrode provided on the first insulator film and having a second diameter smaller than the first diameter.