The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Dec. 17, 2013
Applicant:

Ps4 Luxco S.a.r.l., Luxembourg, LU;

Inventors:

Mitsuaki Katagiri, Tokyo, JP;

Ken Iwakura, Tokyo, JP;

Yutaka Uematsu, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); G11C 5/06 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 23/498 (2013.01); G11C 5/06 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/49 (2013.01); H01L 25/0657 (2013.01); H01L 23/525 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05013 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49176 (2013.01); H01L 2224/49431 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06527 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/15173 (2013.01); H01L 2924/181 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A semiconductor package includes a semiconductor device including a plurality of signal pads and a plurality of auxiliary pads which are alternatively arranged in a predetermined direction, and a package board including a plurality of signal bond fingers, a plurality of first power supply voltage bond fingers, and a plurality of second power supply voltage bond fingers. The signal pads are connected respectively to the signal bond fingers by first wires. The first power supply voltage bond fingers and the second power supply voltage bond fingers are connected respectively to the auxiliary pads by second wires. The first wires are disposed between those of the second wires which are connected to the first power supply voltage bond fingers and those of the second wires which are connected to the second power supply voltage bond fingers.


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