The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Mar. 10, 2014
Applicants:
Ps4 Luxco S.a.r.l., Luxembourg, LU;
Mitsuaki Katagiri, Tokyo, JP;
Yu Hasegawa, Tokyo, JP;
Satoshi Isa, Tokyo, JP;
Inventors:
Assignee:
PS4 LUXCO S.A.R.L., Luxembourg, LU;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/12 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/12 (2013.01); H01L 23/3107 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 21/561 (2013.01); H01L 22/32 (2013.01); H01L 23/3128 (2013.01); H01L 24/03 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05014 (2013.01); H01L 2224/05015 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13028 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/1411 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/14136 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/17517 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3511 (2013.01); H05K 1/025 (2013.01); H05K 1/141 (2013.01); H05K 1/185 (2013.01); H05K 2201/10734 (2013.01);
Abstract
In one semiconductor device, a semiconductor chip has first and second pad electrodes disposed on the main surface thereof, insulating films that cover the main surface of the semiconductor chip, a rewiring layer that is disposed between the insulating films, and a plurality of external terminals disposed on the top of the insulating film. The plane size of the first pad electrode and the second pad electrode differ from one another, and the first pad electrode and the second pad electrode are connected to any of the plurality of external terminals via the rewiring layer.