Satoshi Isa

USPTO Granted Patents = 44 (Patent Applications = 6)

Average Co-Inventor Count = 2.5

ph-index = 9

Forward Citations = 232(Granted Patents)

Location History:

Tokyo Hino, JP (2018 - 2019)
Tokyo, JP (1997 - 2023)

Company Filing History:

Micron Technology Incorporated

7. 1 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 1997-2023

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44 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 11705432 - Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices (2023-07-18),

2. 11081468 - Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses (2021-08-03),

3. 10600762 - Apparatuses comprising semiconductor dies in face-to-face arrangements (2020-03-24),

4. 10431566 - Apparatuses comprising semiconductor dies in face-to-face arrangements (2019-10-01),

5. 10115709 - Apparatuses comprising semiconductor dies in face-to-face arrangements (2018-10-30),

6. 9589921 - Semiconductor device (2017-03-07),

7. 9418967 - Semiconductor device (2016-08-16),

8. 9159663 - Semiconductor device with respective electrode pad rows and respective external electrodes electrically connected and arranged in the respective end portions of the substrate (2015-10-13),

9. 8970052 - Semiconductor device stack with bonding layer and wire retaining member (2015-03-03),

10. 8796077 - Semiconductor device (2014-08-05),

11. 8604601 - Semiconductor device having wiring layers with power-supply plane and ground plane (2013-12-10),

12. 8587097 - Semiconductor device that suppresses malfunctions due to noise generated in internal circuit (2013-11-19),

13. 8581417 - Semiconductor device stack with bonding layer and wire retaining member (2013-11-12),

14. 8569898 - Semiconductor device (2013-10-29),

15. 8426983 - Semiconductor device (2013-04-23),

Title: Satoshi Isa: Pioneering Innovations in Technology

Introduction:

Satoshi Isa, a visionary inventor based in Tokyo, Japan, has become synonymous with groundbreaking innovations that push the boundaries of technology. With an impressive portfolio of 44 patents and a relentless pursuit of excellence, Isa continues to inspire the next generation of inventors worldwide.

Latest Patents:

Isa's latest patents showcase his ingenuity in developing cutting-edge technology. Among them is a stacked die package that revolutionizes semiconductor packaging. This package includes a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, paving the way for advanced systems and devices.

Career Highlights:

Having worked in renowned companies such as Elpida Memory, Inc. and NEC Corporation, Isa has honed his skills and expertise in the field of semiconductor technology. His innovative approach and attention to detail have earned him a reputation as a trailblazer in the industry, with each patent representing a significant milestone in his distinguished career.

Collaborations:

Throughout his career, Isa has collaborated with esteemed professionals such as Mitsuaki Katagiri and Dai Sasaki, combining their knowledge and expertise to drive innovation forward. These collaborations have resulted in groundbreaking inventions that have shaped the future of technology and set new standards for excellence in the industry.

Conclusion:

Satoshi Isa's passion for innovation, coupled with his relentless dedication to excellence, continues to inspire inventors worldwide. His pioneering work in semiconductor technology has not only revolutionized the industry but has also set a benchmark for future generations to follow. As we look towards the future of technology, Isa's legacy serves as a testament to the power of innovation in shaping a brighter tomorrow.

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6 patents pending:

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