The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2013
Filed:
May. 07, 2010
Hiromasa Takeda, Tokyo, JP;
Satoshi Isa, Tokyo, JP;
Mitsuaki Katagiri, Tokyo, JP;
Dai Sasaki, Tokyo, JP;
Hiromasa Takeda, Tokyo, JP;
Satoshi Isa, Tokyo, JP;
Mitsuaki Katagiri, Tokyo, JP;
Dai Sasaki, Tokyo, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
Provided is a semiconductor device with a semiconductor chip mounted on a small-sized package substrate that includes a slot, a large number of external connection terminals, and bonding fingers. The bonding fingers are connected to the external connection terminals. The bonding fingers constitute a bonding finger arrangement in a central section and end sections of a bonding finger area along each longer side of the slot. The arrangement includes a first bonding finger array, which is located at a close distance from each longer side of the slot, and a second array, which is located at a farther distance than the distance of the first bonding finger array from each longer side of the slot. The central section of the bonding finger area includes the second bonding finger array, and the end sections of the bonding finger area include the first bonding finger array.