For the Inventor, By the Inventor

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Alameda, CA, United States of America

Xintec Corporation

Patents = 199

Trademarks = 2

Forward Citations = 1,605

where 'Filed Patents' based on already Granted Patents

where 'Inventors Filed' based on already Granted Patents

125 inventors (with patents filed for the assignee):

Tsang-Yu Liu (78 out of 104 patents)

Yen-Shih Ho (60 out of 72 patents)

Shu-Ming Chang (44 out of 87 patents)

4. Chia-Sheng Lin (31 out of 45 patents)

5. Chia-Ming Cheng (30 out of 45 patents)

6. Chien-Hung Liu (27 out of 157 patents)

7. Ying-Nan Wen (20 out of 33 patents)

8. Chien-Hui Chen (20 out of 26 patents)

9. Po-Han Lee (19 out of 25 patents)

10. Wei-Luen Suen (17 out of 17 patents)

11. Yu-Lung Huang (17 out of 24 patents)

12. Yi-Ming Chang (16 out of 20 patents)

13. Ho-Yin Yiu (15 out of 27 patents)

14. Jiun-Yen Lai (10 out of 10 patents)

15. John L Rink (10 out of 16 patents)

199 patents: Sort by Forward Citations

1. 12487144 - Leakage detecting assembly and sheet leakage detecting module (2025-12-02),

2. 12477848 - Chip package and method for forming the same (2025-11-18),

3. 12473197 - Chip package (2025-11-18),

4. 12463102 - Semiconductor device structure and method for forming the same (2025-11-04),

5. 12424567 - Chip package and manufacturing method thereof (2025-09-23),

6. 12388034 - Chip package and manufacturing method thereof (2025-08-12),

7. 12341109 - Chip package and manufacturing method thereof (2025-06-24),

8. 12272712 - Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region (2025-04-08),

9. 12237354 - Chip package and method for forming the same (2025-02-25),

10. 11973095 - Method for forming chip package with second opening surrounding first opening having conductive structure therein (2024-04-30),

11. 11942563 - Manufacturing method of chip package and chip package (2024-03-26),

12. 11935859 - Chip structure and manufacturing method thereof (2024-03-19),

13. 11873212 - Chip package and manufacturing method thereof (2024-01-16),

14. 11784134 - Chip package and manufacturing method thereof (2023-10-10),

15. 11749618 - Chip package including substrate having through hole and redistribution line (2023-09-05),

Xintec Corporation is a leading provider of innovative telecommunication software solutions. With expertise in advanced analytics, artificial intelligence, and machine learning, Xintec's solutions empower telecom operators to optimize network performance, enhance customer experience, and reduce costs. By leveraging cutting-edge technologies, Xintec enables its clients to stay ahead in the competitive telecommunications industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

199 Patents

#2 in Alameda, CA

#461 in California

#1,994 in US

#4,108 in the World

Alameda, CA, United States of America

Xintec Corporation

Forward Citations = 1,605

125 inventors:

Tsang-Yu Liu (78 out of 104 patents)

Yen-Shih Ho (60 out of 72 patents)

Shu-Ming Chang (44 out of 87 patents)

4. Chia-Sheng Lin (31 out of 45 patents)

5. Chia-Ming Cheng (30 out of 45 patents)

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