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For the Inventor, By the Inventor

Alameda, CA, United States of America

Xintec Corporation


USPTO Granted Patents = 200


Trademarks = 2

Forward Citations = 1,607

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125 inventors (with patents filed for the assignee):

goldMedal Tsang-Yu Liu (78 out of 104 patents)

silverMedal Yen-Shih Ho (60 out of 72 patents)

bronzeMedal Shu-Ming Chang (44 out of 87 patents)

4.  Chia-Sheng Lin (31 out of 45 patents)

5.  Chia-Ming Cheng (30 out of 45 patents)

6.  Chien-Hung Liu (27 out of 158 patents)

7.  Po-Han Lee (20 out of 26 patents)

8.  Ying-Nan Wen (20 out of 33 patents)

9.  Chien-Hui Chen (20 out of 26 patents)

10.  Wei-Luen Suen (17 out of 17 patents)

11.  Yu-Lung Huang (17 out of 24 patents)

12.  Yi-Ming Chang (16 out of 20 patents)

13.  Ho-Yin Yiu (15 out of 27 patents)

14.  Wei-Ming Chien (10 out of 10 patents)

15.  Jiun-Yen Lai (10 out of 10 patents)


Core Competencies:
Chip Package
Semiconductor Device Structure
Manufacturing Method
Antenna Device
Optical Chip Package
Wafer Coating System
Touch Panel-Sensing Module
Chip Scale Sensing Package
Wafer-Level Packaging
Leakage Detection
Electronic Device Package
Chip Structure

200 patents:

1. 12500141 - Semiconductor device structure and semiconductor package assembly (2025-12-16),
2. 12487144 - Leakage detecting assembly and sheet leakage detecting module (2025-12-02),
3. 12477848 - Chip package and method for forming the same (2025-11-18),
4. 12473197 - Chip package (2025-11-18),
5. 12463102 - Semiconductor device structure and method for forming the same (2025-11-04),
6. 12424567 - Chip package and manufacturing method thereof (2025-09-23),
7. 12388034 - Chip package and manufacturing method thereof (2025-08-12),
8. 12341109 - Chip package and manufacturing method thereof (2025-06-24),
9. 12272712 - Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region (2025-04-08),
10. 12237354 - Chip package and method for forming the same (2025-02-25),
11. 11973095 - Method for forming chip package with second opening surrounding first opening having conductive structure therein (2024-04-30),
12. 11942563 - Manufacturing method of chip package and chip package (2024-03-26),
13. 11935859 - Chip structure and manufacturing method thereof (2024-03-19),
14. 11873212 - Chip package and manufacturing method thereof (2024-01-16),
15. 11784134 - Chip package and manufacturing method thereof (2023-10-10),
Xintec Corporation is a leading provider of innovative telecommunication software solutions. With expertise in advanced analytics, artificial intelligence, and machine learning, Xintec's solutions empower telecom operators to optimize network performance, enhance customer experience, and reduce costs. By leveraging cutting-edge technologies, Xintec enables its clients to stay ahead in the competitive telecommunications industry.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 23 2025

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200 Patents

#2 in Alameda, CA

#458 in California

#1,986 in US

#4,094 in the World

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Alameda, CA, United States of America

Xintec Corporation

Forward Citations = 1,607

125 inventors:

goldMedal Tsang-Yu Liu (78 out of 104 patents)

silverMedal Yen-Shih Ho (60 out of 72 patents)

bronzeMedal Shu-Ming Chang (44 out of 87 patents)

4.  Chia-Sheng Lin (31 out of 45 patents)

5.  Chia-Ming Cheng (30 out of 45 patents)

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