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Taoyuan, Taiwan

Xintec Corporation

Calculating rank

USPTO Granted Patents = 203

% Expired Patents = 5.9

EPO Patents = 2

Trademarks = 2

Forward Citations = 1,643

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130 inventors (with patents filed for the assignee):

Tsang-Yu Liu (78 out of 104 patents)

Yen-Shih Ho (60 out of 72 patents)

Shu-Ming Chang (45 out of 88 patents)

4. Chia-Ming Cheng (32 out of 47 patents)

5. Chia-Sheng Lin (31 out of 45 patents)

6. Chien-Hung Liu (27 out of 162 patents)

7. Po-Han Lee (21 out of 27 patents)

8. Ying-Nan Wen (20 out of 33 patents)

9. Chien-Hui Chen (20 out of 26 patents)

10. Wei-Luen Suen (17 out of 17 patents)

11. Yu-Lung Huang (17 out of 24 patents)

12. Yi-Ming Chang (16 out of 20 patents)

13. Ho-Yin Yiu (15 out of 27 patents)

14. Jiun-Yen Lai (11 out of 11 patents)

15. Wei-Ming Chien (10 out of 10 patents)

Core Competencies:

Chip Package

Semiconductor Device

Manufacturing Method

Leakage Detection

Optical Chip Package

Wafer-Level Packaging

Sensing Device

Fabrication Method

Electronic Device Package

Chip Scale Sensing

Substrate Structure

Redistribution Layer

203 patents: Sort by Forward Citations

1. 12772583 - Chip package and manufacturing method thereof (2026-10-20),

2. 12765107 - Chip package and manufacturing method thereof (2026-10-13),

3. 12598974 - Chip package and manufacturing method thereof (2026-04-07),

4. 12500141 - Semiconductor device structure and semiconductor package assembly (2025-12-16),

5. 12487144 - Leakage detecting assembly and sheet leakage detecting module (2025-12-02),

6. 12477848 - Chip package and method for forming the same (2025-11-18),

7. 12473197 - Chip package (2025-11-18),

8. 12463102 - Semiconductor device structure and method for forming the same (2025-11-04),

9. 12424567 - Chip package and manufacturing method thereof (2025-09-23),

10. 12388034 - Chip package and manufacturing method thereof (2025-08-12),

11. 12341109 - Chip package and manufacturing method thereof (2025-06-24),

12. 12272712 - Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region (2025-04-08),

13. 12237354 - Chip package and method for forming the same (2025-02-25),

14. 11973095 - Method for forming chip package with second opening surrounding first opening having conductive structure therein (2024-04-30),

15. 11942563 - Manufacturing method of chip package and chip package (2024-03-26),

Company Overview

Xintec Corporation, headquartered in Taoyuan, Taiwan, specializes in advanced chip package manufacturing. The company focuses on developing innovative solutions in semiconductor devices, emphasizing technologies such as wafer-level packaging and optical chip packages. Xintec is dedicated to enhancing manufacturing methods and ensuring reliability through effective leakage detection and sensing device integration. With a commitment to excellence in fabrication methods, Xintec plays a crucial role in the semiconductor industry, driving advancements in packaging technologies.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

203 Patents

#14 in Taoyuan

#135 in Taiwan

#4,178 in the World

Taoyuan, Taiwan

Xintec Corporation

Forward Citations = 1,643

130 inventors:

Tsang-Yu Liu (78 out of 104 patents)

Yen-Shih Ho (60 out of 72 patents)

Shu-Ming Chang (45 out of 88 patents)

4. Chia-Ming Cheng (32 out of 47 patents)

5. Chia-Sheng Lin (31 out of 45 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Xintec Corporation. Retrieved from https://idiyas.com/company/xintec

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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