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For the Inventor, By the Inventor

Taoyuan, Taiwan

Xintec Corporation


USPTO Granted Patents = 201

% Expired Patents = 6.0


Trademarks = 2

Forward Citations = 1,643

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128 inventors (with patents filed for the assignee):

goldMedal Tsang-Yu Liu (78 out of 104 patents)

silverMedal Yen-Shih Ho (60 out of 72 patents)

bronzeMedal Shu-Ming Chang (44 out of 87 patents)

4.  Chia-Sheng Lin (31 out of 45 patents)

5.  Chia-Ming Cheng (30 out of 45 patents)

6.  Chien-Hung Liu (27 out of 162 patents)

7.  Po-Han Lee (20 out of 26 patents)

8.  Ying-Nan Wen (20 out of 33 patents)

9.  Chien-Hui Chen (20 out of 26 patents)

10.  Wei-Luen Suen (17 out of 17 patents)

11.  Yu-Lung Huang (17 out of 24 patents)

12.  Yi-Ming Chang (16 out of 20 patents)

13.  Ho-Yin Yiu (15 out of 27 patents)

14.  Wei-Ming Chien (10 out of 10 patents)

15.  Jiun-Yen Lai (10 out of 10 patents)


Core Competencies:
Chip Package
Semiconductor Device
Manufacturing Method
Leakage Detection
Optical Chip Package
Wafer-Level Packaging
Sensing Device
Fabrication Method
Electronic Device Package
Chip Scale Sensing
Substrate Structure
Redistribution Layer

201 patents:

1. 12598974 - Chip package and manufacturing method thereof (2026-04-07),
2. 12500141 - Semiconductor device structure and semiconductor package assembly (2025-12-16),
3. 12487144 - Leakage detecting assembly and sheet leakage detecting module (2025-12-02),
4. 12477848 - Chip package and method for forming the same (2025-11-18),
5. 12473197 - Chip package (2025-11-18),
6. 12463102 - Semiconductor device structure and method for forming the same (2025-11-04),
7. 12424567 - Chip package and manufacturing method thereof (2025-09-23),
8. 12388034 - Chip package and manufacturing method thereof (2025-08-12),
9. 12341109 - Chip package and manufacturing method thereof (2025-06-24),
10. 12272712 - Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region (2025-04-08),
11. 12237354 - Chip package and method for forming the same (2025-02-25),
12. 11973095 - Method for forming chip package with second opening surrounding first opening having conductive structure therein (2024-04-30),
13. 11942563 - Manufacturing method of chip package and chip package (2024-03-26),
14. 11935859 - Chip structure and manufacturing method thereof (2024-03-19),
15. 11873212 - Chip package and manufacturing method thereof (2024-01-16),
Xintec Corporation, headquartered in Taoyuan, Taiwan, specializes in advanced chip package manufacturing. The company focuses on developing innovative solutions in semiconductor devices, emphasizing technologies such as wafer-level packaging and optical chip packages. Xintec is dedicated to enhancing manufacturing methods and ensuring reliability through effective leakage detection and sensing device integration. With a commitment to excellence in fabrication methods, Xintec plays a crucial role in the semiconductor industry, driving advancements in packaging technologies.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Oct 6 2026

Xintec Corporation
201 Patents

#14 in Taoyuan

#135 in Taiwan

#4,205 in the World

Taoyuan, TW
Taoyuan, Taiwan

Xintec Corporation

Forward Citations = 1,643

128 inventors:

goldMedal Tsang-Yu Liu (78 out of 104 patents)

silverMedal Yen-Shih Ho (60 out of 72 patents)

bronzeMedal Shu-Ming Chang (44 out of 87 patents)

4.  Chia-Sheng Lin (31 out of 45 patents)

5.  Chia-Ming Cheng (30 out of 45 patents)

Please report any incorrect information to [email protected]
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