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For the Inventor, By the Inventor

Taoyuan, Taiwan

Xintec Corporation


USPTO Granted Patents = 201

% Expired Patents = 6.0


Trademarks = 2

Forward Citations = 1,643

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128 inventors (with patents filed for the assignee):

goldMedal Tsang-Yu Liu (78 out of 104 patents)

silverMedal Yen-Shih Ho (60 out of 72 patents)

bronzeMedal Shu-Ming Chang (44 out of 87 patents)

4.  Chia-Sheng Lin (31 out of 45 patents)

5.  Chia-Ming Cheng (30 out of 45 patents)

6.  Chien-Hung Liu (27 out of 162 patents)

7.  Po-Han Lee (20 out of 26 patents)

8.  Ying-Nan Wen (20 out of 33 patents)

9.  Chien-Hui Chen (20 out of 26 patents)

10.  Wei-Luen Suen (17 out of 17 patents)

11.  Yu-Lung Huang (17 out of 24 patents)

12.  Yi-Ming Chang (16 out of 20 patents)

13.  Ho-Yin Yiu (15 out of 27 patents)

14.  Wei-Ming Chien (10 out of 10 patents)

15.  Jiun-Yen Lai (10 out of 10 patents)


Core Competencies:
Chip Package
Semiconductor Device
Manufacturing Method
Leakage Detection
Optical Chip Package
Wafer-Level Packaging
Sensing Device
Fabrication Method
Electronic Device Package
Chip Scale Sensing
Substrate Structure
Redistribution Layer

201 patents:

1. 12598974 - Chip package and manufacturing method thereof (2026-04-07),
2. 12500141 - Semiconductor device structure and semiconductor package assembly (2025-12-16),
3. 12487144 - Leakage detecting assembly and sheet leakage detecting module (2025-12-02),
4. 12477848 - Chip package and method for forming the same (2025-11-18),
5. 12473197 - Chip package (2025-11-18),
6. 12463102 - Semiconductor device structure and method for forming the same (2025-11-04),
7. 12424567 - Chip package and manufacturing method thereof (2025-09-23),
8. 12388034 - Chip package and manufacturing method thereof (2025-08-12),
9. 12341109 - Chip package and manufacturing method thereof (2025-06-24),
10. 12272712 - Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region (2025-04-08),
11. 12237354 - Chip package and method for forming the same (2025-02-25),
12. 11973095 - Method for forming chip package with second opening surrounding first opening having conductive structure therein (2024-04-30),
13. 11942563 - Manufacturing method of chip package and chip package (2024-03-26),
14. 11935859 - Chip structure and manufacturing method thereof (2024-03-19),
15. 11873212 - Chip package and manufacturing method thereof (2024-01-16),
Xintec Corporation is a leading provider of innovative telecommunication software solutions. With expertise in advanced analytics, artificial intelligence, and machine learning, Xintec's solutions empower telecom operators to optimize network performance, enhance customer experience, and reduce costs. By leveraging cutting-edge technologies, Xintec enables its clients to stay ahead in the competitive telecommunications industry.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Sep 15 2026

Xintec Corporation
201 Patents

#14 in Taoyuan

#135 in Taiwan

#4,201 in the World

Taoyuan, TW
Taoyuan, Taiwan

Xintec Corporation

Forward Citations = 1,643

128 inventors:

goldMedal Tsang-Yu Liu (78 out of 104 patents)

silverMedal Yen-Shih Ho (60 out of 72 patents)

bronzeMedal Shu-Ming Chang (44 out of 87 patents)

4.  Chia-Sheng Lin (31 out of 45 patents)

5.  Chia-Ming Cheng (30 out of 45 patents)

Please report any incorrect information to [email protected]
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