Taipei, Taiwan

Chia-Ming Cheng


Average Co-Inventor Count = 2.9

ph-index = 4

Forward Citations = 41(Granted Patents)


Location History:

  • Xinzhuang, TW (2013 - 2014)
  • Taipei, TW (2013 - 2015)
  • Jhongli, TW (2015)
  • New Taipei, TW (2013 - 2024)

Company Filing History:


Years Active: 2013-2025

Loading Chart...
45 patents (USPTO):

Title: Innovations by Chia-Ming Cheng: Pioneering Chip Packaging Technologies

Introduction

Chia-Ming Cheng, a prolific inventor based in New Taipei, Taiwan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 43 patents, Cheng has been at the forefront of innovations in chip packaging, focusing on enhancing the efficiency and functionality of microelectronic devices.

Latest Patents

Among Cheng's latest inventions is a patent titled "Method for forming chip package with second opening surrounding first opening having conductive structure therein." This patent describes a unique chip package design that features a substrate with dual openings, enhancing the integration of electrical components and facilitating improved performance in sensor devices.

Another notable patent is "Chip package and manufacturing method thereof," which defines a chip package configuration incorporating light-transmissive sheets and an innovative antenna layer. This design not only advances the structural integrity of chip packages but also optimizes their operational capabilities in various applications.

Career Highlights

Cheng's career has been marked by his tenure at notable companies such as Xintec Corporation, where he has honed his expertise in semiconductor manufacturing and design. His experience has enabled him to create groundbreaking technologies that address the evolving needs of the electronics industry.

Collaborations

Throughout his career, Cheng has collaborated with esteemed colleagues, including Tsang-Yu Liu and Shu-Ming Chang. These partnerships have fostered a collaborative environment for innovation, leading to advancements in chip packaging technologies that benefit a range of sectors.

Conclusion

Chia-Ming Cheng's remarkable achievements in the realm of patents and technology underscore his role as a leading innovator in semiconductor packaging. His contributions continue to inspire advancements that pave the way for more efficient and effective electronic devices. As the industry evolves, Cheng's work will undoubtedly remain a key influence on future innovations in the field.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…