The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Oct. 20, 2020
Applicant:
Xintec Inc., Taoyuan, TW;
Inventors:
Assignee:
XINTEC iNC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0352 (2006.01); H01L 31/18 (2006.01); H01L 31/02 (2006.01); H01L 31/0216 (2014.01);
U.S. Cl.
CPC ...
H01L 31/0352 (2013.01); H01L 31/02005 (2013.01); H01L 31/02164 (2013.01); H01L 31/1876 (2013.01);
Abstract
A chip package includes a chip and a conductive structure. A first surface of the chip has a photodiode. A second surface of the chip facing away from the first surface has a recess aligned with the photodiode. The conductive structure is located on the first surface of the chip.
Lee, Po-Han. (2022). Chip package and manufacturing method thereof (U.S. Patent No. 11355659). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11355659
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile