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For the Inventor, By the Inventor

Taipei, Taiwan

Po-Han Lee

This inventor holds 27 USPTO granted patents and 14 published patent applications, primarily in Chip Packaging. Top assignees: Xintec Corporation, National Chung Shan Institute of Science and Technology, Other. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Po-Han Lee. Retrieved from https://idiyas.com/inventor/po-han-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 4

Forward Citations = 37(Granted Patents)


Company Filing History:

goldMedal21 out of 203 
 
Xintec Corporation
 patents
silverMedal1 out of 222 
 
National Chung Shan Institute of Science and Technology
 patents
bronzeMedal5 out of 834,570 
Other
 patents

Years Active: 2012-2026

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Areas of Expertise:
Chip Package
Semiconductor Device
Manufacturing Method
Electrical Contact Structure
Anode Material
Nano-Silicon
Multilayer-Graphene
Power Module
Fabrication Methods
Redistribution Layer
Electronic Device Package
27 patents (USPTO):Explore Patents
1. 12772583 - Chip package and manufacturing method thereof (2026-10-20),
2. 12500141 - Semiconductor device structure and semiconductor package assembly (2025-12-16),
3. 11476293 - Manufacturing method of chip package (2022-10-18),
4. 11387201 - Chip package and manufacturing method thereof (2022-07-12),
5. 11355659 - Chip package and manufacturing method thereof (2022-06-07),
6. 11310904 - Chip package and power module (2022-04-19),
7. 11038077 - Chip package and manufacturing method thereof (2021-06-15),
8. 10879530 - Anode material of nano-silicon having multilayer-graphene as carrier and coated with silicon suboxide and with amorphous carbon layer and method for fabricating the same (2020-12-29),
9. 10446504 - Chip package and method for forming the same (2019-10-15),
10. 10424540 - Chip package and method for forming the same (2019-09-24),
11. 10153237 - Chip package and method for forming the same (2018-12-11),
12. 10096635 - Semiconductor structure and manufacturing method thereof (2018-10-09),
13. 9947716 - Chip package and manufacturing method thereof (2018-04-17),
14. 9875912 - Chip package and manufacturing method thereof (2018-01-23),
15. 9780251 - Semiconductor structure and manufacturing method thereof (2017-10-03),

Title: Inventor Po-Han Lee: Revolutionizing Technology from Taipei, TW

Introduction: Po-Han Lee is a visionary inventor hailing from Taipei, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Po-Han Lee holds several patents in the areas of artificial intelligence, robotics, and renewable energy technologies, showcasing his innovative spirit and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Po-Han Lee has worked with leading tech companies, research institutions, and universities to develop cutting-edge solutions that have redefined the industry standards.

Collaborations: Po-Han Lee has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of innovation and knowledge-sharing that has led to remarkable advancements in various technological domains.

Conclusion: Po-Han Lee's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true pioneer in the world of inventions, inspiring the next generation of inventors to dream big and create a better future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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