The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
Oct. 25, 2019
Applicant:
Xintec Inc., Taoyuan, TW;
Inventors:
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0215 (2013.01); H01L 24/29 (2013.01); H05K 1/0346 (2013.01); H01L 2224/29139 (2013.01);
Abstract
A chip package includes a high voltage withstanding substrate and a device chip. The high voltage withstanding substrate has a main body, a functional layer, and a grounding layer. The main body has a top surface, a bottom surface opposite the top surface, a through hole through the top surface and the bottom surface, and a sidewall surrounding the through hole. The functional layer is located on the top surface. The grounding layer covers the bottom surface and the sidewall. The device chip is located on the functional layer, and has a grounding pad that faces the main body. The grounding pad is electrically connected to the grounding layer in the through hole.