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For the Inventor, By the Inventor

Zhubei, Taiwan

Tsang-Yu Liu

USPTO Granted Patents = 104

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 195(Granted Patents)

Forward Citations (Not Self Cited) = 182(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Hsinchu, TW (2013 - 2014)
  • Jhongli, TW (2015)
  • Zhubei, TW (2012 - 2024)

Company Filing History:

goldMedal78 out of 199 
 
Xintec Corporation
 patents
silverMedal26 out of 832,680 
Other
 patents

Years Active: 2012-2025

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104 patents (USPTO):
1. 12473197 - Chip package (2025-11-18),
2. 12272712 - Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region (2025-04-08),
3. 12237354 - Chip package and method for forming the same (2025-02-25),
4. 11942563 - Manufacturing method of chip package and chip package (2024-03-26),
5. 11873212 - Chip package and manufacturing method thereof (2024-01-16),
6. 11746003 - Chip package (2023-09-05),
7. 11705368 - Manufacturing method of chip package and chip package (2023-07-18),
8. 11476293 - Manufacturing method of chip package (2022-10-18),
9. 11319208 - Chip package and manufacturing method thereof (2022-05-03),
10. 11310904 - Chip package and power module (2022-04-19),
11. 11137559 - Optical chip package and method for forming the same (2021-10-05),
12. 11121031 - Manufacturing method of chip package and chip package (2021-09-14),
13. 11107759 - Chip package and manufacturing method thereof (2021-08-31),
14. 10950738 - Chip package and method for forming the same (2021-03-16),
15. 10833118 - Chip package and manufacturing method thereof (2020-11-10),

Title: Innovations by Tsang-Yu Liu: A Pioneer in Chip Packaging Technology

Introduction: Tsang-Yu Liu, a prolific inventor based in Zhubei, Taiwan, has significantly impacted the field of semiconductor technology through his remarkable contributions. With an impressive portfolio of 101 patents, Liu has been at the forefront of innovations that enhance the efficiency and performance of chip packaging methods.

Latest Patents: Among his latest inventions, Liu has developed a manufacturing method of a chip package that entails intricate processes. This method includes patterning a wafer to create a scribe trench, integrating a light-transmissive function layer strategically positioned between the wafer and carrier. The cutting process that follows allows for the formation of a chip package, which consists of the chip, the light-transmissive function layer, and the carrier. Additionally, his patent on a chip package showcases a semiconductor substrate featuring an opening and a metal layer with a MEMS (Microelectromechanical Systems) structure, showcasing cutting-edge materials and design techniques.

Career Highlights: Liu's career has seen him contribute significantly to leading companies in the semiconductor sector, including Xintec Corporation. His innovative approaches and dedication to improving chip packaging technology have made him a key figure in his field.

Collaborations: Throughout his career, Liu has collaborated with notable colleagues, including Yen-Shih Ho and Shu-Ming Chang. Together, they have worked to advance semiconductor technologies and contribute to the collective knowledge in the field.

Conclusion: Tsang-Yu Liu's extensive work and dedication to innovation in chip packaging manufacturing underscore his status as a leading inventor in the semiconductor industry. His patents not only reflect his expertise but also pave the way for future developments in efficient chip technologies. Through his efforts, Liu continues to inspire innovation and progress within the field.

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