The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Apr. 17, 2020
Xintec Inc., Taoyuan, TW;
Jiun-Yen Lai, Taipei, TW;
Yu-Ting Huang, Taoyuan, TW;
Hsing-Lung Shen, Hsinchu, TW;
Tsang-Yu Liu, Zhubei, TW;
Hui-Hsien Wu, Taoyuan, TW;
XINTEC INC., Taoyuan, TW;
Abstract
An optical chip package is provided. The optical chip package includes a first transparent substrate, a second transparent substrate, and a spacer layer. The first and second transparent substrates each has a first surface and a second surface opposite the first surface. The first transparent substrate has a thickness that is different than that of the second transparent substrate. The second transparent substrate is disposed over the first transparent substrate, and the spacer layer is bonded between the second surface of the first transparent substrate and the first surface of the second transparent substrate. The recess region extends from the second surface of the second transparent substrate into the first transparent substrate, so that the first transparent substrate has a step-shaped sidewall. A method of forming an optical chip package is also provided.