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For the Inventor, By the Inventor

Hsinchu, Taiwan

Hsing-Lung Shen

USPTO Granted Patents = 8

Average Co-Inventor Count = 3.9

ph-index = 1


Company Filing History:

goldMedal8 out of 199 
 
Xintec Corporation
 patents

Years Active: 2017-2025

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8 patents (USPTO):
1. 12473197 - Chip package (2025-11-18),
2. 11873212 - Chip package and manufacturing method thereof (2024-01-16),
3. 11137559 - Optical chip package and method for forming the same (2021-10-05),
4. 11107759 - Chip package and manufacturing method thereof (2021-08-31),
5. 10049252 - Chip package and fabrication method thereof (2018-08-14),
6. 9972584 - Chip package and manufacturing method thereof (2018-05-15),
7. 9793234 - Chip package and manufacturing method thereof (2017-10-17),
8. 9548265 - Chip package and manufacturing method thereof (2017-01-17),

Title: Hsing-Lung Shen: Innovator in Chip Packaging Technology

Introduction

Hsing-Lung Shen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in chip packaging. With a total of 8 patents to his name, Shen has established himself as a key figure in the industry.

Latest Patents

Shen's latest patents focus on innovative chip packaging solutions. One of his notable inventions is a chip package that includes a semiconductor substrate and a metal layer. The semiconductor substrate features an opening and a sidewall surrounding it, with the upper portion of the sidewall designed as a concave surface. This substrate is made from silicon, while the metal layer, which is positioned on top, contains multiple through holes above the opening to define a MEMS (Microelectromechanical system) structure. The metal layer is composed of aluminum, enhancing the package's functionality and efficiency.

Another significant patent by Shen is related to the manufacturing method of the chip package, which shares similar features to his previous invention. This method emphasizes the importance of the semiconductor substrate and metal layer in creating effective MEMS structures.

Career Highlights

Hsing-Lung Shen is currently employed at Xintec Corporation, where he continues to innovate in the semiconductor field. His work has been instrumental in advancing chip packaging technologies, which are crucial for the performance of modern electronic devices.

Collaborations

Shen has collaborated with notable colleagues, including Tsang-Yu Liu and Jiun-Yen Lai. Their combined expertise has contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Hsing-Lung Shen's contributions to chip packaging technology have made a lasting impact on the semiconductor industry. His innovative patents and collaborative efforts continue to drive advancements in this critical field.

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