The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Apr. 27, 2016
Applicant:
Xintec Inc., Taoyuan, TW;
Inventors:
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 31/0203 (2014.01); H01L 21/78 (2006.01); H01L 31/0216 (2014.01); H01L 33/62 (2010.01); H01L 23/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 21/76898 (2013.01); H01L 21/78 (2013.01); H01L 22/32 (2013.01); H01L 22/34 (2013.01); H01L 23/315 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/3178 (2013.01); H01L 23/3185 (2013.01); H01L 31/0203 (2013.01); H01L 31/02164 (2013.01); H01L 33/62 (2013.01); H01L 21/561 (2013.01); H01L 23/481 (2013.01); H01L 2224/11 (2013.01);
Abstract
A chip package includes a chip, a dam layer, a carrier substrate and a light shielding passivation layer. The chip has a first surface and a second surface opposite to the first surface, and a side surface is disposed between the first surface and the second surface. The dam layer is disposed on the first surface, and the carrier substrate is disposed on the dam layer. The light shielding passivation layer is disposed under the second surface and extended into the carrier substrate to cover the side surface of the chip.