Jiun-Yen Lai

Title: Innovations of Jiun-Yen Lai

Introduction

Jiun-Yen Lai is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on advanced chip structures and manufacturing methods, showcasing his expertise in this rapidly evolving industry.

Latest Patents

One of his latest patents is titled "Chip structure and manufacturing method thereof." This invention describes a chip structure that includes a first substrate, a second substrate, a conductive via, and a redistribution layer. The first substrate features a first inclined sidewall, while the second substrate is positioned on the bottom surface of the first substrate, consisting of an upper portion and a lower portion. The upper portion is situated between the first substrate and the lower portion, with a second inclined sidewall. The conductive via is located in the lower portion, and the redistribution layer extends from the top surface of the first substrate to the top surface of the lower portion, ensuring electrical connectivity.

Another notable patent is "Chip package and manufacturing method thereof." This invention outlines a chip package that comprises a semiconductor substrate and a metal layer. The semiconductor substrate has an opening surrounded by a sidewall, with the upper portion of the sidewall being concave. The semiconductor substrate is made from silicon, while the metal layer, which is composed of aluminum, is positioned on the semiconductor substrate. This metal layer features multiple through holes above the opening, defining a MEMS (Microelectromechanical system) structure.

Career Highlights

Jiun-Yen Lai is currently employed at Xintec Corporation, where he continues to innovate and develop cutting-edge technologies in the semiconductor field. His work has significantly impacted the industry, contributing to advancements in chip design and manufacturing processes.

Collaborations

Throughout his career, Jiun-Yen has collaborated with talented individuals such as Wei-Luen Suen and Hsing-Lung Shen. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Jiun-Yen Lai's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His innovative work continues to shape the future of chip design and manufacturing.