The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Dec. 13, 2023
Applicant:
Xintec Inc., Taoyuan, TW;
Inventors:
Wei-Luen Suen, Taoyuan, TW;
Jiun-Yen Lai, Taoyuan, TW;
Hsing-Lung Shen, Hsinchu, TW;
Tsang-Yu Liu, Zhubei, TW;
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0067 (2013.01); B81C 1/00317 (2013.01); B81B 2203/0353 (2013.01); B81C 2201/0125 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/0194 (2013.01);
Abstract
A chip package includes a semiconductor substrate and a metal layer. The semiconductor substrate has an opening and a sidewall surrounding the opening, in which an upper portion of the sidewall is a concave surface. The semiconductor substrate is made of a material including silicon. The metal layer is located on the semiconductor substrate. The metal layer has plural through holes above the opening to define a MEMS (Microelectromechanical system) structure, in which the metal layer is made of a material including aluminum.