Taipei, Taiwan

Wei-Luen Suen

This inventor holds 17 USPTO granted patents and 11 published patent applications, primarily in Chip Packaging. Top assignee: Xintec Corporation. Active years: 2015-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei-Luen Suen. Retrieved from https://idiyas.com/inventor/wei-luen-suen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 100.0

Average Co-Inventor Count = 4.8

ph-index = 3

Forward Citations = 32(Granted Patents)


Location History:

  • New Taipei, TW (2015 - 2018)
  • Taoyuan, TW (2021 - 2024)

Company Filing History:


Years Active: 2015-2025

Loading Chart...
Areas of Expertise:
Chip Package
Semiconductor Structure
Antenna Device
Manufacturing Method
Electrical Contact Structure
Redistribution Layer
Stacked Chip Package
Alignment Mark
17 patents (USPTO):Explore Patents

Title: Innovations of Wei-Luen Suen

Introduction

Wei-Luen Suen is a prominent inventor based in New Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 16 patents. His work focuses on advanced chip packaging and antenna devices, showcasing his expertise in microelectromechanical systems (MEMS).

Latest Patents

One of his latest patents is titled "Chip package and manufacturing method thereof." This invention describes a chip package that includes a semiconductor substrate and a metal layer. The semiconductor substrate features an opening surrounded by a sidewall, with the upper portion of the sidewall designed as a concave surface. The substrate is made from silicon, while the metal layer, composed of aluminum, contains multiple through holes that define a MEMS structure.

Another notable patent is the "Antenna device and manufacturing method thereof." This invention consists of a first substrate, a second substrate, an antenna layer, and a redistribution layer. The first substrate has a first surface and a second surface, with an inclined sidewall connecting them. The antenna layer is positioned on the first surface, and the redistribution layer extends from the second surface to the second substrate along the inclined sidewall, ensuring effective communication between components.

Career Highlights

Wei-Luen Suen is currently employed at Xintec Corporation, where he continues to innovate in the semiconductor industry. His work has significantly impacted the development of advanced technologies in chip packaging and antenna design.

Collaborations

He collaborates with talented coworkers, including Yen-Shih Ho and Tsang-Yu Liu, who contribute to the success of their projects and innovations.

Conclusion

Wei-Luen Suen's contributions to semiconductor technology through his patents demonstrate his expertise and commitment to innovation. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…