The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Jul. 23, 2014
Xintec Inc., Jhongli, Taoyuan County, TW;
Yen-Shih Ho, Kaohsiung, TW;
Tsang-Yu Liu, Zhubei, TW;
Shu-Ming Chang, New Taipei, TW;
Yu-Lung Huang, Daxi Township, TW;
Chao-Yen Lin, New Taipei, TW;
Wei-Luen Suen, New Taipei, TW;
Chien-Hui Chen, Zhongli, TW;
Ho-Yin Yiu, Hong Kong, CN;
XINTEC INC., Taoyuan, TW;
Abstract
A chip package including a chip is provided. The chip includes a sensing region or device region adjacent to an upper surface of the chip. A sensing array is located in the sensing region or device region and includes a plurality of sensing units. A plurality of first openings is located in the chip and correspondingly exposes the sensing units. A plurality of conductive extending portions is disposed in the first openings and is electrically connected to the sensing units, wherein the conductive extending portions extend from the first openings onto the upper surface of the chip. A method for forming the chip package is also provided.