Average Co-Inventor Count = 3.0

ph-index = 9

Forward Citations = 281(Granted Patents)

Forward Citations (Not Self Cited) = 272(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hsinchu, TW (2006 - 2011)
Hsin Chu Hsien, TW (2011)
Taipei County, TW (2009 - 2013)
Nantou, TW (2011 - 2013)
Tucheng, TW (2007 - 2014)
Taipei, TW (2008 - 2014)
Tucheng Dist, TW (2015)
Jhongli, TW (2015)
New Taipei, TW (2012 - 2023)

Company Filing History:

Industrial Technology Research Institute

4. 26 out of 832,843

Other

patents

Years Active: 2006-2025

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Areas of Expertise:

Chip Package

Manufacturing Method

Sensing Module

Touch Panel-Sensing Chip

Chip Scale Sensing

Semiconductor Structure

Stacked Chip Package

Power MOSFET Package

Electromagnetic Shielding

Electronic Device Package

Fabrication Method

87 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12477848 - Chip package and method for forming the same (2025-11-18),

2. 12341109 - Chip package and manufacturing method thereof (2025-06-24),

3. 12272712 - Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region (2025-04-08),

4. 12237354 - Chip package and method for forming the same (2025-02-25),

5. 11784134 - Chip package and manufacturing method thereof (2023-10-10),

6. 11749618 - Chip package including substrate having through hole and redistribution line (2023-09-05),

7. 11746003 - Chip package (2023-09-05),

8. 11521938 - Chip package including substrate inclined sidewall and redistribution line (2022-12-06),

9. 11319208 - Chip package and manufacturing method thereof (2022-05-03),

10. 11164853 - Chip package and manufacturing method thereof (2021-11-02),

11. 10950738 - Chip package and method for forming the same (2021-03-16),

12. 10446504 - Chip package and method for forming the same (2019-10-15),

13. 10318784 - Touch panel-sensing chip package module complex and a manufacturing method thereof (2019-06-11),

14. 10152180 - Chip scale sensing chip package and a manufacturing method thereof (2018-12-11),

15. 10049252 - Chip package and fabrication method thereof (2018-08-14),

Title: The Inventor Profile of Shu-Ming Chang

Introduction: Shu-Ming Chang is a distinguished inventor hailing from New Taipei, Taiwan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Shu-Ming Chang holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his innovative prowess and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Shu-Ming Chang has worked with leading tech companies, research institutions, and universities, playing a pivotal role in developing cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Shu-Ming Chang has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of innovation and knowledge exchange.

Conclusion: Shu-Ming Chang's dedication to innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology.

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