The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Jul. 15, 2019
Applicant:

Xintec Inc., Taoyuan, TW;

Inventors:

Shu-Ming Chang, New Taipei, TW;

Tsang-Yu Liu, Zhubei, TW;

Assignee:

XINTEC INC., Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0216 (2014.01); H01L 33/62 (2010.01); H01L 31/14 (2006.01); H01L 31/0232 (2014.01); H01L 31/18 (2006.01); H01L 31/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02164 (2013.01); H01L 31/02002 (2013.01); H01L 31/02327 (2013.01); H01L 31/14 (2013.01); H01L 31/18 (2013.01); H01L 33/62 (2013.01);
Abstract

A chip package is provided. the chip package includes a substrate having an upper surface, a lower surface, and a sidewall surface that is at an edge of the substrate. The substrate includes a sensing device adjacent to the upper surface of the substrate to sense a light source. The chip package also includes a first color filter layer disposed on the upper surface of the substrate to shield the light source. The first color filter layer includes an opening, so that the first color filter layer surrounds the sensing device via the opening. In addition, the chip package includes a redistribution layer disposed on the lower surface of the substrate. A method of forming the chip package is also provided.


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