The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Jun. 08, 2016
Applicant:
Xintec Inc., Taoyuan, TW;
Inventors:
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00013 (2013.01); G06F 3/041 (2013.01); G06F 2203/0338 (2013.01); G06F 2203/04103 (2013.01); G06K 9/00053 (2013.01);
Abstract
This invention provides a touch panel-sensing chip package module complex, comprising: a touch panel with a first top surface and a first bottom surface opposite to each other, wherein the first bottom surface having a first cavity with a bottom wall surrounded by a sidewall; a color layer formed on the bottom wall and the first bottom surface adjacent to the cavity; and a chip scale sensing chip package module bonded to the cavity by the color layer formed on the bottom wall of the cavity.
Chang, Shu-Ming. (2019). Touch panel-sensing chip package module complex and a manufacturing method thereof (U.S. Patent No. 10318784). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10318784
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile