Kaohsiung, Taiwan

Yen-Shih Ho

USPTO Granted Patents = 72 

Average Co-Inventor Count = 4.3

ph-index = 5

Forward Citations = 91(Granted Patents)

Forward Citations (Not Self Cited) = 83(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Jhongli, TW (2014 - 2015)
  • Kaohsiung, TW (2013 - 2022)

Company Filing History:


Years Active: 2013-2022

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72 patents (USPTO):

Title: Innovations and Contributions of Yen-Shih Ho

Introduction

Yen-Shih Ho, a prolific inventor based in Kaohsiung, Taiwan, has made significant strides in the field of semiconductor packaging. With an impressive portfolio of 72 patents, he has contributed to advancements in manufacturing methods and chip packaging technologies.

Latest Patents

Yen-Shih Ho's recent patents showcase his innovative approach toward chip packaging. One notable patent outlines a manufacturing method of a chip package that involves creating a temporary bonding layer on a carrier and forming an encapsulation layer on a wafer's surface. This process includes bonding the carrier to the wafer, exposing conductive pads through a patterned bottom surface, and adding multiple protective and functional layers, culminating in the removal of the temporary bonding layer and carrier.

Another significant patent is for a chip package that integrates an intricate sidewall structure comprising light-shielding layers and a cover. This design efficiently houses a light emitter and a light receiver, facilitating optimal performance of optical functions. The innovation not only showcases his technical expertise but also highlights advancements aimed at enhancing the efficiency and functionality of semiconductor devices.

Career Highlights

Yen-Shih Ho has worked with several exemplary companies throughout his career, notably Xintec Corporation, where his expertise has driven forward-thinking projects within the semiconductor industry. His commitment and innovative mindset have been vital in fostering a culture of creativity and collaboration in each organization he has been part of.

Collaborations

Throughout his career, Yen-Shih Ho has collaborated with distinguished professionals such as Tsang-Yu Liu and Shu-Ming Chang. These partnerships have led to groundbreaking innovations in chip packaging and manufacturing methodologies, underscoring the importance of teamwork in driving technological advancements.

Conclusion

Yen-Shih Ho stands as an influential figure in the realm of semiconductor innovation, with his extensive patent portfolio reflecting his dedication to enhancing chip manufacturing processes. As technology continues to evolve, his contributions will undoubtedly play a pivotal role in shaping the future of electronic devices.

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