The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Nov. 22, 2016
Xintec Inc., Taoyuan, TW;
Yen-Shih Ho, Kaohsiung, TW;
Hsiao-Lan Yeh, Tainan, TW;
Chia-Sheng Lin, Taoyuan, TW;
Yi-Ming Chang, Taoyuan, TW;
Po-Han Lee, Taipei, TW;
Hui-Hsien Wu, Taoyuan, TW;
Jyun-Liang Wu, Taichung, TW;
Shu-Ming Chang, New Taipei, TW;
Yu-Lung Huang, Taoyuan, TW;
Chien-Min Lin, Taoyuan, TW;
XINTEC INC., Taoyuan, TW;
Abstract
A chip package includes a chip, an adhesive layer, and a dam element. The chip has a sensing area, a first surface, and a second surface that is opposite to the first surface. The sensing area is located on the first surface. The adhesive layer covers the first surface of the chip. The dam element is located on the adhesive layer and surrounds the sensing area. The thickness of the dam element is in a range from 20 μm to 750 μm, and the wall surface of the dam element surrounding the sensing area is a rough surface.