Hsiao-Lan Yeh

Title: Hsiao-Lan Yeh: Innovator in Semiconductor Technology

Introduction

Hsiao-Lan Yeh is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative work has advanced the development of semiconductor devices and manufacturing processes.

Latest Patents

One of Hsiao-Lan Yeh's latest patents is titled "Semiconductor device structure and method for forming the same." This patent describes a semiconductor device structure that includes a first transparent substrate, a conductive layer, an insulating protective layer, a second transparent substrate, a device substrate, and a bonding layer. The design aims to enhance the efficiency and functionality of semiconductor devices.

Another notable patent is the "Wafer coating system and method of manufacturing chip package." This invention features a wafer coating system that includes a wafer chuck, a flowing insulating material sprayer, and a wafer tilting lifting pin. The system is designed to improve the manufacturing process of chip packages, ensuring better quality and performance.

Career Highlights

Hsiao-Lan Yeh is currently employed at Xintec Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in developing advanced manufacturing techniques that are crucial for the semiconductor industry.

Collaborations

Hsiao-Lan Yeh has collaborated with notable colleagues, including Yen-Shih Ho and Chia-Sheng Lin. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Hsiao-Lan Yeh is a distinguished inventor whose contributions to semiconductor technology have made a lasting impact. His innovative patents and collaborative efforts continue to shape the future of the industry.