The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

May. 01, 2023
Applicant:

Xintec Inc., Taoyuan, TW;

Inventors:

Hsiao-Lan Yeh, Tainan, TW;

Chin-Kang Chen, Taoyuan, TW;

Kung-Hua Cheng, Taoyuan, TW;

Szu-Hui Ma Lee, Taoyuan, TW;

Chi-Jia Tong, Taoyuan, TW;

Assignee:

XINTEC INC., Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 21/02 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 23/142 (2013.01); H01L 21/02348 (2013.01); H01L 21/56 (2013.01); H01L 21/6835 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01);
Abstract

A semiconductor device structure is provided. The semiconductor device structure includes a first transparent substrate, a conductive layer, an insulating protective layer, a second transparent substrate, a device substrate, and a bonding layer. The first transparent substrate has a first surface and an opposite second surface. The conductive layer is disposed on the second surface of the first transparent substrate. The insulating protective layer covers the conductive layer and the first transparent substrate. The second transparent substrate is disposed above the first transparent substrate, and has a first surface facing the first transparent substrate and an opposite second surface. The device substrate is disposed on the second surface of the second transparent substrate. The bonding layer is bonded to the insulating protective layer and the first surface of the second transparent substrate.


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