Taoyuan, Taiwan

Chin-Kang Chen


Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2018-2025

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2 patents (USPTO):

Title: Inventor Chin-Kang Chen and His Contribution to Chip Packaging Technology

Introduction

Chin-Kang Chen is an accomplished inventor based in Taoyuan, Taiwan, known for his innovative contributions to chip packaging technology. With a passion for enhancing electronic devices, Chen has secured a patent that showcases his expertise in designing advanced chip packages.

Latest Patents

Chen holds a notable patent for a "Chip Package and Manufacturing Method Thereof." This invention involves a sophisticated chip package that comprises several essential components, including a chip, an insulating layer, and a conductive layer. The design features a substrate, an epitaxy layer, a device region, and a conductive pad, all expertly integrated to optimize performance. The conductive pad extends out from the side surface of the epitaxy layer, providing crucial connectivity. Additionally, the insulating layer is strategically positioned beneath the substrate, while the conductive layer aligns perfectly beneath the insulating layer, ensuring the conductive pad is effectively contacted. This innovative arrangement maintains necessary separation, enhancing the functionality of chip packages.

Career Highlights

Chin-Kang Chen is currently a key member of Xintec Corporation, where he continues to work on groundbreaking technologies that push the boundaries of electronic packaging. His patent underscores his commitment to advancing the field, demonstrating both technical expertise and an innovative mindset.

Collaborations

In his professional journey, Chen collaborates closely with talented coworkers like Shun-Wen Long and Guo-Jyun Chiou. These partnerships enhance his projects, fostering an environment rich in creativity and technical proficiency.

Conclusion

Chin-Kang Chen represents a significant figure in the realm of innovation within the electronics industry. His patent on chip packaging technology not only highlights his ingenuity but also paves the way for advancements in device efficiency and performance. Through his work at Xintec Corporation and fruitful collaborations, Chen continues to impact the technological landscape positively.

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