The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Dec. 28, 2016
Xintec Inc., Taoyuan, TW;
Shun-Wen Long, Taoyuan, TW;
Guo-Jyun Chiou, Taoyuan, TW;
Meng-Han Kuo, Taipei, TW;
Ming-Chieh Huang, Kaohsiung, TW;
Hsi-Chien Lin, Zhubei, TW;
Chin-Kang Chen, Taoyuan, TW;
Yi-Pin Chen, Zhubei, TW;
XINTEC INC., Taoyuan, TW;
Abstract
A chip package includes a chip, an insulating layer and a conductive layer. The chip includes a substrate, an epitaxy layer, a device region and a conductive pad. The epitaxy layer is disposed on the substrate, and the device region and the conductive pad are disposed on the epitaxy layer. The conductive pad is at a side of the device region and connected to the device region. The conductive pad protrudes out of a side surface of the epitaxy layer. The insulating layer is disposed below the substrate and extended to cover the side surface of the epitaxy layer. The conductive layer is disposed below the insulating layer and extended to contact the conductive pad. The conductive layer and the side surface of the epitaxy layer are separated by a first distance.