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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10388541 B1

PDFFull Text
Date of Patent:
Aug. 20, 2019

Filed:

Apr. 13, 2016

Wafer coating system and method of manufacturing chip package

Applicant:

Xintec Inc., Taoyuan, TW;

Inventors:

Yu-Tung Chen, Taoyuan, TW;

Quan-Qun Su, New Taipei, TW;

Chuan-Jin Shiu, Taoyuan, TW;

Chien-Hui Chen, Taoyuan, TW;

Hsiao-Lan Yeh, Tainan, TW;

Yen-Shih Ho, Kaohsiung, TW;

Assignee:

XINTEC INC., Taoyuan, TW;

Attorney:

Liu & Liu

Primary Examiner:

Marvin Payen

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 23/31 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/6715 (2013.01); H01L 21/68742 (2013.01); H01L 21/68764 (2013.01); H01L 21/76831 (2013.01); H01L 23/3192 (2013.01); H01L 21/76898 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/94 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/94 (2013.01);
Abstract

A wafer coating system includes a wafer chuck, a flowing insulating material sprayer and a wafer tilting lifting pin. The wafer chuck has a carrier part and a rotating part, which the carrier part is mounted on the rotating part to carry a wafer, and the rotating part is configured to rotate with a predetermined axis. The flowing insulating material sprayer is above the wafer chuck and configured to spray a flowing insulating material to the wafer, and the wafer tilting lifting pin is configured to form a first acute angle between the wafer and direction of gravity.

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