Chien-Hui Chen

This inventor holds 26 USPTO granted patents, primarily in Chip Packaging Technology. Top assignees: Xintec Corporation, Other. Active years: 2013-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chien-Hui Chen. Retrieved from https://idiyas.com/inventor/chien-hui-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26

% Patents Active = 92.3

Average Co-Inventor Count = 4.4

ph-index = 5

Forward Citations = 89(Granted Patents)

Location History:

Taoyuan County, TW (2013 - 2014)
Jhongli, TW (2014)
Zhongli, TW (2013 - 2017)
Taoyuan, TW (2016 - 2019)

Company Filing History:

20 out of 202

Xintec Corporation

patents

6 out of 834,513

Other

patents

Years Active: 2013-2019

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Areas of Expertise:

Wafer Coating

Chip Package

Semiconductor Structure

Stacked Chip Package

Wafer Level Array

Alignment Mark

Substrate Structure

Through Vias

Light-Emitting Diode

Fabrication Method

High-Reflection Submount

26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10388541 - Wafer coating system and method of manufacturing chip package (2019-08-20),

2. 9711403 - Method for forming chip package (2017-07-18),

3. 9437478 - Chip package and method for forming the same (2016-09-06),

4. 9425134 - Chip package (2016-08-23),

5. 9355975 - Chip package and method for forming the same (2016-05-31),

6. 9355970 - Chip package and method for forming the same (2016-05-31),

7. 9349710 - Chip package and method for forming the same (2016-05-24),

8. 9318461 - Wafer level array of chips and method thereof (2016-04-19),

9. 9305843 - Chip package and method for forming the same (2016-04-05),

10. 9275963 - Semiconductor structure having stage difference surface and manufacturing method thereof (2016-03-01),

11. 9209124 - Chip package (2015-12-08),

12. 9184092 - Chip package and method for forming the same (2015-11-10),

13. 9165890 - Chip package comprising alignment mark and method for forming the same (2015-10-20),

14. 9024437 - Chip package and method for forming the same (2015-05-05),

15. 8963312 - Stacked chip package and method for forming the same (2015-02-24),

Title: The Innovative Journey of Chien-Hui Chen

Introduction:

Chien-Hui Chen, a talented inventor hailing from Zhongli, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chen's latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles, revolutionizing the way we approach transportation technology.

Career Highlights:

Throughout his illustrious career, Chen has been at the forefront of technological innovation, with a focus on developing sustainable solutions for complex problems. His work has garnered international recognition and praise for its ingenuity and practicality.

Collaborations:

Chen has collaborated with leading research institutions and tech companies to bring his inventions to life. His ability to work across disciplines and industries has led to the creation of truly transformative technologies.

Conclusion:

In conclusion, Chien-Hui Chen's dedication to pushing the boundaries of innovation has solidified his reputation as a visionary inventor. His passion for creating a better future through technology continues to inspire the next generation of inventors and innovators.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]