The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Mar. 14, 2014
Xintec Inc., Jhongli, Taoyuan County, TW;
Yu-Lin Yen, Taipei, TW;
Chien-Hui Chen, Zhongli, TW;
Tsang-Yu Liu, Zhubei, TW;
Long-Sheng Yeou, Hsinchu, TW;
XINTEC INC., Taoyuan, TW;
Abstract
A method for forming a chip package, by providing a substrate having a plurality of conducting pads below a lower surface, and a dielectric layer located between the conducting pads, forming a recess in an upper surface of the substrate, forming a hole extending through the bottom of the recess, forming an insulating layer on the sidewall of the recess and in the hole, exposing a portion of the conducting pads through the insulating layer, and forming a conducting layer on the insulating layer and through the hole to contact with the conducting pads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile