Location History:
- Jhongli, TW (2015)
- Hsin Chu, TW (1998 - 2017)
Company Filing History:
5 out of 200 
3 out of 40,780 
6 out of 832,843 Years Active: 1998-2017
Title: **Innovative Contributions of Long-Sheng Yeou in Chip Packaging Technology**
Introduction
Long-Sheng Yeou, an accomplished inventor based in Hsinchu, Taiwan, has made significant strides in the field of chip packaging technology. With a remarkable portfolio of 14 patents, Yeou’s work focuses on enhancing the efficiency and performance of semiconductor devices. His innovations have positioned him as a notable figure in the technology sector.
Latest Patents
Among Yeou's latest contributions is a patent for a chip package and the method for forming the same. This invention presents a chip package that includes a substrate featuring an upper surface and a lower surface, with a strategically designed hole extending between them. The incorporation of an insulating layer along the sidewall of the hole and a material layer that decreases in thickness towards the lower surface showcases his innovative approach to chip packaging. Additionally, he has patented a method for forming such a chip package, beginning with a substrate containing multiple conducting pads and employing a dielectric layer for improved functionality.
Career Highlights
Yeou's career has been marked by his significant contributions while working at Xintec Corporation, where he utilized his expertise to push the boundaries of chip packaging technology. His inventive spirit and technical knowledge have driven him to pioneer methods that bolster the performance and reliability of semiconductor devices.
Collaborations
In the course of his career, Yeou has collaborated with notable professionals such as Tsang-Yu Liu and Yu-Lin Yen, blending their talents to innovate and enhance chip packaging solutions. These partnerships have facilitated the exchange of ideas and expertise, leading to advancements in the field.
Conclusion
Long-Sheng Yeou's innovative contributions have significantly impacted the semiconductor industry. With a focus on developing advanced chip packaging methods, he continues to inspire future innovations. As technology progresses, his work will remain crucial in shaping the future of semiconductor devices.