The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Feb. 09, 2011
Yu-lin Yen, Taipei, TW;
Ming-kun Yang, Pingzhen, TW;
Tsang-yu Liu, Zhubei, TW;
Long-sheng Yeou, Hsinchu, TW;
Yu-Lin Yen, Taipei, TW;
Ming-Kun Yang, Pingzhen, TW;
Tsang-Yu Liu, Zhubei, TW;
Long-Sheng Yeou, Hsinchu, TW;
XINTEC INC., Taoyuan, TW;
Abstract
According to an embodiment of the invention, a chip package is provided, which includes: a substrate having an upper surface and a lower surface; a hole extending from the upper surface toward the lower surface; an insulating layer located overlying a sidewall of the hole; and a material layer located overlying the sidewall of the hole, wherein the material layer is separated from the upper surface of the substrate by a distance and a thickness of the material layer decreases along a direction toward the lower surface.