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Title: Inventor Ming-Kun Yang: Pioneering Advances in Chip Packaging Technology
Introduction
Ming-Kun Yang, an accomplished inventor from Pingzhen, Taiwan, has made significant contributions to the field of chip packaging technology. With a total of three patents to his name, Yang stands at the forefront of innovation in semiconductor device manufacturing.
Latest Patents
Among his notable patents, Yang has developed methods for forming chip packages that improve efficiency and reliability. One such invention describes a process that begins with a substrate having a first and a second surface, equipped with conducting pads on the upper surface. The method involves creating holes that extend towards the first surface, aligning with the conducting pads, followed by the formation of an insulating layer on the sidewalls and a conducting layer on top, ensuring electrical contact with the pads.
Another significant patent presents a chip package featuring a substrate with a hole extending from its upper to lower surface. This design incorporates an insulating layer over the sidewall, combined with a material layer that decreases in thickness toward the lower surface. These innovations are crucial for enhancing the performance of electronic devices.
Career Highlights
Yang has had the opportunity to work with notable companies, including Xintec Corporation, where he played a key role in advancing chip packaging technologies. His work in the semiconductor industry has positioned him as an influential figure in the field.
Collaborations
Throughout his career, Yang has collaborated with esteemed colleagues such as Tsang-Yu Liu and Yen-Shih Ho. Their joint efforts have further propelled advancements in innovative semiconductor solutions.
Conclusion
Ming-Kun Yang's contributions to chip packaging technology not only exemplify his ingenuity but also highlight the importance of continued innovation in the electronics industry. As he moves forward in his career, his patents serve as a testament to his dedication to improving the performance and efficiency of electronic devices.