The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Jan. 17, 2012
Chien-hui Chen, Zhongli, TW;
Ming-kun Yang, Pingzhen, TW;
Tsang-yu Liu, Zhubei, TW;
Yen-shih Ho, Kaohsiung, TW;
Chien-Hui Chen, Zhongli, TW;
Ming-Kun Yang, Pingzhen, TW;
Tsang-Yu Liu, Zhubei, TW;
Yen-Shih Ho, Kaohsiung, TW;
XINTEC INC., Taoyuan, TW;
Abstract
An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least two conducting pads are disposed on the first surface of the substrate; partially removing the substrate from the second surface of the substrate to form at least two holes extending towards the first surface, wherein the holes correspondingly and respectively align with one of the conducting pads; after the holes are formed, partially removing the substrate from the second substrate to form at least a recess extending towards the first surface, wherein the recess overlaps with the holes; forming an insulating layer on a sidewall and a bottom of the trench and on sidewalls of the holes; and forming a conducting layer on the insulating layer, wherein the conducting layer electrically contacts with one of the conducting pads.