The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
Aug. 05, 2011
Yu-lin Yen, Taipei, TW;
Chien-hui Chen, Zhongli, TW;
Tsang-yu Liu, Zhubei, TW;
Long-sheng Yeou, Hsinchu, TW;
Yu-Lin Yen, Taipei, TW;
Chien-Hui Chen, Zhongli, TW;
Tsang-Yu Liu, Zhubei, TW;
Long-Sheng Yeou, Hsinchu, TW;
Other;
Abstract
A chip package includes a substrate having an upper surface and a lower surface, a plurality of conducting pads located under the lower surface of the substrate, and a dielectric layer located between the conducting pads. A hole is provided in the substrate, which extends from the upper surface towards the lower surface of the substrate. A sidewall or a bottom of the hole exposes a portion of the conducting pads. The upper opening of the hole near the upper surface is smaller than a lower opening of the hole near the lower surface. An upper conducting pad has at least an opening or a trench exposing a lower conducting pad of the conducting pads. A conducting layer is disposed in the hole, which electrically contacting at least one of the conducting pads.