The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2013

Filed:

Mar. 09, 2011
Applicants:

Yu-lin Yen, Taipei, TW;

Chien-hui Chen, Zhongli, TW;

Tsang-yu Liu, Zhubei, TW;

Long-sheng Yeou, Hsinchu, TW;

Inventors:

Yu-Lin Yen, Taipei, TW;

Chien-Hui Chen, Zhongli, TW;

Tsang-Yu Liu, Zhubei, TW;

Long-Sheng Yeou, Hsinchu, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to an embodiment of the invention, a chip package is provided. The chip package includes a substrate having an upper surface and a lower surface, a plurality of conducting pads located in the substrate or under the lower surface thereof, a dielectric layer located between the conducting pads, a hole extending from the upper surface towards the lower surface of the substrate and exposing a portion of the conducting pads, and a conducting layer located in the hole and electrically contacting the conducting pads.


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