The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Jul. 23, 2014
Xintec Inc., Jhongli, Taoyuan County, TW;
Yen-Shih Ho, Kaohsiung, TW;
Tsang-Yu Liu, Zhubei, TW;
Shu-Ming Chang, New Taipei, TW;
Yu-Lung Huang, Daxi Township, TW;
Chao-Yen Lin, New Taipei, TW;
Wei-Luen Suen, New Taipei, TW;
Chien-Hui Chen, Zhongli, TW;
XINTEC INC., Taoyuan, TW;
Abstract
A chip package is provided. The chip package includes a chip having an upper surface, a lower surface and a sidewall. The chip includes a sensing region or device region and a signal pad region adjacent to the upper surface. A shallow recess structure is located outside of the signal pad region and extends from the upper surface toward the lower surface along the sidewall. The shallow recess structure has at least a first recess and a second recess under the first recess. A redistribution layer is electrically connected to the signal pad region and extends into the shallow recess structure. A first end of a wire is located in the shallow recess structure and is electrically connected to the redistribution layer. A second end of the wire is used for external electrical connection. A method for forming the chip package is also provided.