Taipei, Taiwan

Chao-Yen Lin


Average Co-Inventor Count = 3.9

ph-index = 4

Forward Citations = 32(Granted Patents)


Location History:

  • Ruifang Township, Taipei County, TW (2012 - 2013)
  • New Taipei, TW (2013 - 2016)

Company Filing History:


Years Active: 2012-2016

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12 patents (USPTO):

Title: Chao-Yen Lin: Innovator in Chip Packaging Technology

Introduction

Chao-Yen Lin is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 12 patents. His innovative designs and methods have advanced the capabilities of electronic devices.

Latest Patents

Among his latest patents is a chip package and method for forming the same. This invention includes a chip that features a sensing region or device region adjacent to its upper surface. The chip is equipped with a sensing array that comprises multiple sensing units. Additionally, a series of first openings in the chip expose these sensing units, while conductive extending portions are electrically connected to them. Another notable patent is a chip package that includes a chip with an upper surface, lower surface, and sidewall. This design incorporates a shallow recess structure that enhances the functionality of the signal pad region.

Career Highlights

Chao-Yen Lin has worked with Xintec Corporation, where he has further honed his skills in chip packaging technology. His work has been instrumental in developing advanced solutions that meet the growing demands of the electronics industry.

Collaborations

Throughout his career, Chao-Yen Lin has collaborated with talented individuals such as Yu-Lung Huang and Wei-Luen Suen. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Chao-Yen Lin's contributions to chip packaging technology are noteworthy and reflect his dedication to innovation. His patents and collaborations continue to influence the field, showcasing his role as a leading inventor in the industry.

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