The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Jul. 24, 2013
Xintec Inc., Jhongli, TW;
Yu-Lung Huang, Daxi Township, TW;
Chao-Yen Lin, New Taipei, TW;
Wei-Luen Suen, New Taipei, TW;
Chien-Hui Chen, Zhongli, TW;
Xintec, Inc., Jhongli, TW;
Abstract
An embodiment of the invention provides a chip package which includes: a semiconductor substrate having an upper surface and a lower surface; a device region or sensing region defined in the semiconductor substrate; a conducting pad located on the upper surface of the semiconductor substrate; at least two recesses extending from the upper surface towards the lower surface of the semiconductor substrate, wherein sidewalls and bottoms of the recesses together form a sidewall of the semiconductor substrate; a conducting layer electrically connected to the conducting pad and extending from the upper surface of the semiconductor substrate to the sidewall of the semiconductor substrate; and an insulating layer located between the conducting layer and the semiconductor substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile