The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Dec. 03, 2015
Applicant:
Xintec Inc., Taoyuan, TW;
Inventors:
Yu-Lung Huang, Taoyuan, TW;
Chao-Yen Lin, New Taipei, TW;
Wei-Luen Suen, New Taipei, TW;
Chien-Hui Chen, Taoyuan, TW;
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 23/58 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 21/283 (2006.01);
U.S. Cl.
CPC ...
H01L 23/585 (2013.01); H01L 21/283 (2013.01); H01L 21/4853 (2013.01); H01L 21/78 (2013.01);
Abstract
An embodiment of the invention provides a chip package including a semiconductor substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A side recess is on at least a first side of the semiconductor substrate, wherein the side recess extends from the first surface toward the second surface and across the entire length of the first side. A conducting layer is located on the first surface and electrically connected to the conducting pad, wherein the conducting layer extends to the side recess.