The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Oct. 01, 2014
Applicant:
Xintec Inc., Jhongli, Taoyuan County, TW;
Inventors:
Chien-Hui Chen, Zhongli, TW;
Tsang-Yu Liu, Zhubei, TW;
Chun-Wei Chang, New Taipei, TW;
Chia-Ming Cheng, New Taipei, TW;
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 25/065 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/6835 (2013.01); H01L 23/562 (2013.01); H01L 23/564 (2013.01); H01L 2221/68327 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A method for forming a chip package is provided. A first substrate is provided. A second substrate is attached on the first substrate, wherein the second substrate has a plurality of rectangular chip regions separated by a scribed-line region. A portion of the second substrate corresponding to the scribed-line region is removed to form a plurality of chips on the first substrate, wherein at least one bridge portion is formed between adjacent chips. A chip package formed by the method is also provided.