The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Jan. 13, 2015
Applicant:
Xintec Inc., Jhongli, Taoyuan County, TW;
Inventors:
Bing-Siang Chen, Taipei, TW;
Chien-Hui Chen, Zhongli, TW;
Shu-Ming Chang, New Taipei, TW;
Tsang-Yu Liu, Zhubei, TW;
Yen-Shih Ho, Kaohsiung, TW;
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 21/78 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/16 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01);
Abstract
An embodiment of the invention provides a chip package which includes: a first chip; a second chip disposed on the first chip, wherein a side surface of the second chip is a chemically-etched surface; and a bonding bulk disposed between the first chip and the second chip such that the first chip and the second chip are bonded with each other.