Location History:
- Jhongli, TW (2014)
- Taipei, TW (2014 - 2016)
Company Filing History:
Years Active: 2014-2016
Title: The Innovator Behind Cutting-Edge Chip Technologies: Bing-Siang Chen
Introduction
Bing-Siang Chen, an accomplished inventor based in Taipei, Taiwan, has made significant contributions to the field of semiconductor technology. With a total of three patents under his name, Chen continues to push the boundaries of innovation in chip packaging and substrate structures.
Latest Patents
Among his most recent inventions, Chen has developed a notable patent for a "Chip package and method for forming the same." This invention incorporates a first and a second chip, with the second chip featuring a chemically-etched side surface. The innovative design also includes a bonding bulk that effectively connects both chips.
Another significant patent is focused on a "Substrate structure with through vias." This patented design features a semiconductor substrate with a back surface and a via that penetrates through it. The structure integrates multiple layers, including metal and insulating layers, to enhance functionality and performance. The trench insulating layer, a key aspect of this design, contributes to the robustness and efficiency of the substrate.
Career Highlights
Bing-Siang Chen is affiliated with Xintec Corporation, a leader in providing advancement in semiconductor packaging technologies. His work has not only elevated the standards in his field but has also paved the way for new methodologies in chip design and manufacturing.
Collaborations
In his journey of innovation, Chen works alongside talented coworkers such as Chien-Hui Chen and Yen-Shih Ho. Their collaborative efforts have propelled several projects forward, enhancing Xintec Corporation's capabilities in delivering cutting-edge semiconductor solutions.
Conclusion
Bing-Siang Chen exemplifies the spirit of innovation within the semiconductor industry. His contributions through various patents showcase his expertise and commitment to advancing technology. As he continues to work at Xintec Corporation, the industry eagerly anticipates his future inventions and impact.